model:HAP-100U
Sample diameter:3 (option: 4 inch), can be used for grinding and polishing 3 (option: 4 inch) wafers
Sample tilt angle:0-10 degrees adjustable
Usage:Magnetic testing
Standard:ASME JB/T6066-2005
Blank type:forged pieces
Measurement range:0~50μm
Power consumption:Not more than 25 W
Power supply:AC 220V±10%, 50~60Hz
Polishing resolution:1 micron
Sample tilt angle:0-10 degrees adjustable
Sample loading force:Continuously adjustable from 0-4 kg
Display unit:CPM、CPS、Bq/cm2、mSv、μGy/h、mGy/h
Relative basic error:plus or minus 15% or less
Measuring time:1, 10, 20, 60, 120 seconds is optional
Range:0-15000 mm ,at steel velocity
Material Velocity:100~20000 m/s
Pulse Repetition Frequency:10-10000Hz
Circumfluence magnetization current:AC 0-4000A continuously adjustable with power off phase control
Longitudinal magnetization potential:AC 0- (3000A*6T) 18000AT continuously adjustable with power off phase control
Clamping stroke:0 mm-1500 mm
Circumferential magnetization current (A):4000
Longitudinal magnetization MMF (AT):12000、16000、18000
Optional coil inner diameter (mm):350、400、500
AC current:0-1500A
Power supply:220V (two-phase three-wire system) ±10%, 50Hz, instantaneous current is about 100A;
Magnetization method:AC magnetization, DC magnetization (HWDC/FWDV)
Magnetic electrode distance:45~225mm
Power cord length (spring wire):3m
Temperature rise:Handle surface temperature ≤40 ° C
Longitudinal magnetizing flux potential(AT):12000
Inside diameter of coil(mm):400
Control mode:Manual/semi-automatic
Detector:High performance silicon drift SDD detection module
Analyze the main elements in the alloy:can analyze Mg, Al, Si, P, S, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Se, Zr, Nb, Mo, Rh, Pd, Ag, Cd, Sn, Sb, Hf, Ta, W, Re, Pb, and Bi,total 30 elements (can be added further)
Analytical methods:Direct reading analysis method+basic parameter method(FP)